推荐同事 机构合作 中文 繁體中文 English 한국어 日本語 Português Español

美国ACCDON公司旗下品牌

021-33361733,021-33632861

chinasupport@letpub.com

登录 注册 新注册优惠

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

2023年12月最新中科院分区表数据已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

按期刊名首写字母查看 J MATER SCI-MAT最新评论:2024年1月22日投稿 2024年3月27日收到审稿意见(小修) 2024年4月15日提交 2024年4月25日接受 (2024-04-25)


期刊名:   ISSN:   研究方向:   影响因子: -   SCI收录:
大类学科:   小类学科:   中科院分区:   是否OA期刊:   结果排序:

按研究方向查看:


JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS期刊基本信息Hello,您是该期刊的第468989位访客


基本信息 登录收藏
期刊名字JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

J MATER SCI-MATER EL
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
6.8
115人评分
我要评分

声誉
7.2

影响力
6.1

速度
8.0

期刊ISSN0957-4522
微信扫码收藏此期刊
E-ISSN1573-482X
2022-2023最新影响因子
(数据来源于搜索引擎)
2.8 点击查看影响因子趋势图
实时影响因子 截止2024年3月26日:2.715
2022-2023自引率7.10%点击查看自引率趋势图
五年影响因子2.5
h-index 63
CiteScore
CiteScoreSJRSNIPCiteScore排名
4.600.4960.681
学科分区排名百分位
大类:Engineering
小类:Electrical and Electronic Engineering
Q2259 / 738
大类:Engineering
小类:Condensed Matter Physics
Q2155 / 423
大类:Engineering
小类:Atomic and Molecular Physics, and Optics
Q278 / 211
大类:Engineering
小类:Electronic, Optical and Magnetic Materials
Q2106 / 271

期刊简介
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
期刊官方网站https://www.springer.com/10854
期刊投稿网址https://www.editorialmanager.com/jmse
作者指南网址https://www.springer.com/10854/submission-guidelines
期刊语言要求Language
Presenting your work in a well-structured manuscript and in well-written English gives it its best chance for editors and reviewers to understand it and evaluate it fairly. Many researchers find that getting some independent support helps them present their results in the best possible light.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS的语言要求,还能让JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人得到更好的审稿体验,让稿件最大限度地被JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢(4篇)
提交文稿
是否OA开放访问No
通讯方式SPRINGER, VAN GODEWIJCKSTRAAT 30, DORDRECHT, NETHERLANDS, 3311 GZ
出版商Springer US
涉及的研究方向工程技术-材料科学:综合
出版国家或地区NETHERLANDS
出版语言English
出版周期Monthly
出版年份1990
年文章数 1901点击查看年文章数趋势图
Gold OA文章占比1.35%
研究类文章占比:
文章 ÷(文章 + 综述)
99.16%
WOS期刊SCI分区
2022-2023年最新版
WOS分区等级:2区

按学科分区JIF分区JIF排名JIF百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC
类别:SCIE
Q2137/275
学科:MATERIALS SCIENCE, MULTIDISCIPLINARY
类别:SCIE
Q3200/342
学科:PHYSICS, APPLIED
类别:SCIE
Q274/159
学科:PHYSICS, CONDENSED MATTER
类别:SCIE
Q233/66
中科院《国际期刊预警
名单(试行)》名单
2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
中科院SCI期刊分区
2023年12月最新升级版
点击查看中科院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
工程技术 2区4区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区4区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
2区2区4区
PHYSICS, APPLIED
物理:应用
3区3区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
1区3区4区
中科院SCI期刊分区
2022年12月升级版
大类学科小类学科Top期刊综述期刊
工程技术 3区4区1区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区2区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区2区4区
PHYSICS, APPLIED
物理:应用
4区4区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
2区1区4区
中科院SCI期刊分区
2021年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 1区4区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区4区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区3区4区
PHYSICS, APPLIED
物理:应用
1区2区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
2区1区4区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0957-4522%5BISSN%5D
平均审稿速度期刊官网数据:
平均33 days, Submission to first decision
92 days, Submission to acceptance

网友分享经验:
平均1.5个月
平均录用比例网友分享经验:
90%
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
收稿范围期刊官网数据:
材料现代电子学中的应用的研究论文,期刊涉及的主题广泛,包括新材料(例如化合物和合金)的合成、生长和制备,加工、制造、键合和封装,微观结构的表征,结构-性质关系,电,光,介电和磁性能。以及新材料在电子领域的应用。
收录体裁期刊官网数据:
Research papers, commentaries, introductions, editorials, reports, errata, etc
编辑信息Editor-in-Chief:

Safa Kasap
University of Saskatchewan, Canada

Founding Editor and Former Editor-in-Chief:

Arthur F. W. Willoughby
Southampton University, UK

Deputy Editors-in-Chief:

Jun Luo
Chinese Academy of Sciences, China

Patrick J. McNally
Dublin City University, Ireland

Editors:

Peter Capper
Selex ES, UK

Homero Castaneda-Lopez
Texas A&M University, USA

Kalyan Kumar Chattopadhyay
Javadpur University, India

I.M. Dharmadasa
Sheffield Hallam University, UK

Chris Groves
Durham University, UK

C. Robert Kao
National Taiwan University, Taiwan

Maurizio Martino
Università del Salento, Italy

Yun Hau Ng
City University of Hong Kong, Hong Kong

Amlan J. Pal
Indian Association for the Cultivation of Science, India

Henry H. Radamson
Royal Institute of Technology, Sweden

Karthik Shankar
University of Alberta, Canada

Velumani Subramaniam
CINVESTAV, Mexico

Stephen Sweeney
University of Surrey, UK

Hongjing Wu
Northwestern Polytechnical University, China

Wu Yan
China University of Geosciences (Wuhan), China

Ying Yang
Tsinghua University, China

Bangmin Zhang
Sun Yat-Sen University, China

Fu Rong Zhu
Hong Kong Baptist University, Hong Kong

Assistant Editor:

Chunzi Zhang
University of Saskatchewan, Canada

Editorial Board:

Sadao Adachi, Gunma University, Japan; Dan Allwood, University of Sheffield, UK; Hajime Asahi, Osaka University, Japan; Neil S. Beattie Northumbria University, UK; Bhaskar Bhattacharya, Banaras Hindu University, India; Rana Biswas, Ames Laboratory & Iowa State University, USA; Anna Paola Caricato, Università del Salento, Italy; Y.C. (Archie) Chan, City University of Hong Kong, China; Parthasarathi Chakraborti, Intel Corporation, Hillsboro, Oregon, USA; Nandu Chaure, Savitribai Phule Pune University, India; Kunji Chen, Nanjing University, China; W. (Jim) Choyke, University of Pittsburgh, USA; Antonin Fejfar, Academy of Sciences of the Czech Republic, Czech Republic; Darrel Frear, Freescale Semiconductor, USA; Jan Evans-Freeman, University of Canterbury, New Zealand; Shubhra Gangopadhyay, University of Missouri-Columbia, USA; Christopher Gourlay, Imperial College London, UK; Jong Heo, Pohang University of Science and Technology, Korea; Dan Hewak, University of Southampton, UK; Oliver Ileperuma, Institute of Chemistry Ceylon, Sri Lanka; Alessia Irrera CNR- Institute for Chemical and Physical Processes (IPCF), Messina, Italy; Stuart J. C. Irvine, Swansea University, UK; Chennupati Jagadish, The Australian National University, Australia; David Jiles, Iowa State University, USA; Hannah J. Joyce, Cambridge University, UK; Zahangir Kabir; Concordia University, Canada; Karen Kavanagh, Simon Fraser University, Canada; Iwan Kityk Czestochowa University of Technology, Poland; Chien-Neng Liao, National Tsing Hua University, Taiwan; Leszek Malkinski, University of New Orleans, USA; Budhika Mendis Durham University, UK; Maria Mitkova Boise State University, USA; Yashowanta Mohapatra, Indian Institute of Technology Kanpur, India; Hadis Morkoç, Virginia Commonwealth University, USA; Hiroyoshi Naito, Osaka Prefecture University, Japan; Hiroshi Nishikawa, Osaka University, Japan; Habib Pathan, Savitribai Phule Pune University, India; Kristin M. Poduska, Memorial University of Newfoundland, Canada; Adithya Prakash, Intersil, USA; Jatin Rath Indian Institute of Technology, Madras, India; Alla Reznik Lakehead University, Thunder Bay, Canada; Ben Ruck, Victoria University of Wellingon, New Zealand; Harry Ruda, University of Toronto, Canada; Arie Ruzin Tel Aviv University, Israel; Rene van Swaaij, Delft University of Technology, The Netherlands; Katsuhisa Tanaka, Kyoto University, Japan; Ayse Turak, McMaster University, Canada; Takashi Uchino, Kobe University, Japan; Neil White, University of Southampton, UK; Takayuki Yanagida, Nara Institute of Science and Technology, Japan; Alex (Ya Sha) Yi, University of Michigan, USA
期刊常用信息链接
同领域相关期刊 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS中科院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中科院SCI期刊分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发表论文
  • 中科院SCI期刊分区相关期刊
  • 同类著名期刊名称 h-index CiteScore
    NATURE MATERIALS40358.30
    Nature Nanotechnology28654.60
    PROGRESS IN MATERIALS SCIENCE14467.50
    MATERIALS SCIENCE & ENGINEERING R-REPORTS12956.10
    ADVANCED MATERIALS44745.50
    Materials Today13833.50
    ADVANCED FUNCTIONAL MATERIALS26927.90
    Nano Today11919.40
    ACS Nano31025.40
    INTERNATIONAL MATERIALS REVIEWS9533.10
    中科院SCI期刊分区同大类学科的热搜期刊 浏览次数
    Chemical Engineering Journal3359684
    Energy1348991
    Fuel1288448
    APPLIED ENERGY1216912
    Construction and Building Materials1053478
    JOURNAL OF POWER SOURCES968867
    INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH947817
    MEASUREMENT904017
    INTERNATIONAL JOURNAL OF HYDROGEN ENERGY881623
    SEPARATION AND PURIFICATION TECHNOLOGY842234
  •  

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
  •  

     
  •  

     
  •  

     
  • 中国学者近期发表的论文
    1.A facile fabrication of nanocomposites with dual conductive networks based on 3D nickel foam, 1D silver nanowires and 2D boron nitride nanosheets

    Author: Zhu, Shuangbao; Li, Weizhen; Yuan, Weichao; Meng, Yiming; Chu, Zhongyang; Gan, Wenjun
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09582-y
        DOI
    2.Controllable preparation of CaCu3Ti4O12 nanowires and its strengthening effect on high dielectric polymer composites

    Author: Zhu, Min; Li, Guan; Xu, Haiping; Xie, Huaqing; Liao, Yangke
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09417-w
        DOI
    3.Low-hysteresis perovskite solar cells based on a spray-coated electron transport layer

    Author: Zheng, Xiaohong; Su, Jian; Liu, Shanyi; Guo, Huafei; Gu, Ding; Jiang, Sai; Qiu, Jianhua
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09690-9
        DOI
    4.Relaxation behavior and energy storage of A-site substituted Sr4-xNa2-xLaxTa0.6Nb9.4O30 ferroelectric ceramics

    Author: Zheng, Xiao; Jin, Zuheng; Dan, Yuejun; Hu, Changzheng; Liu, Laijun; Fang, Liang
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 2, pp. -. DOI: 10.1007/s10854-022-09492-z
        DOI
    5.Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties

    Author: Zhao, Zhili; Xiao, Kai; Quan, Wenlei; Hu, Mingdeng; Li, Jiazhe
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09675-8
        DOI
    6.Highly conductive films sintered by Au-Ag nanoparticles ink at low temperature

    Author: Zhang, Zhen; Li, Jinglong; Liu, Tao; Tian, Wenhuai; Li, Zhipeng
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 2, pp. -. DOI: 10.1007/s10854-022-09649-w
        DOI
    7.Construction of foot-movement monitoring sensor based on triboelectric signals via embroidery technique with PDMS coated conductive cotton yarn

    Author: Zhang, Shichen
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 1, pp. -. DOI: 10.1007/s10854-022-09464-3
        DOI
    8.Sintering characteristics, crystal structure, and microwave dielectric properties of non-stoichiometric BaMg2V2+xO8 (0.04 <= x <= 0.16) ceramics

    Author: Zhang, Ping; Fan, Xinyue; Hao, Manman; Tian, Xin
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09558-y
        DOI
    9.Efficient MXene/CNT electromagnetic shielding composite films with self-assembly multilayer structure

    Author: Zhang, Pengcheng; Ru, Xuanhe; Li, Haiyang; Liang, Haoyu; Wang, Huanping; Yang, Chenhui; Zhang, Xiaoguang; Liu, Zhenguo; Zhang, Qiuyu; Chen, Yanhui
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 1, pp. -. DOI: 10.1007/s10854-022-09498-7
        DOI
    10.A low reflection absorbent conductive carbon black-coated BaZn2Fe16O27 composite covering X and Ku bands

    Author: Zhang, Jing
    Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09655-y
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    Nature Electronics038.30
    PROGRESS IN ENERGY AND COMBUSTION SCIENCE16159.00
    Annual Review of Fluid Mechanics16352.90
    IEEE Reviews in Biomedical Engineering027.80
    TRENDS IN BIOTECHNOLOGY19531.30
    Advanced Fiber Materials012.50
    BIOTECHNOLOGY ADVANCES16127.10
    RENEWABLE & SUSTAINABLE ENERGY REVIEWS22226.30
    Chemical Engineering Journal17221.50
    IEEE SIGNAL PROCESSING MAGAZINE15522.40
    同分区等级的其他期刊名称 h-index CiteScore
    HARVARD BUSINESS REVIEW02.40
    QJM-AN INTERNATIONAL JOURNAL OF MEDICINE1086.10
    Energy Material Advances08.50
    CLINICAL AND EXPERIMENTAL HYPERTENSION453.60
    Journal of Public Transportation07.00
    Asian Journal of Psychiatry010.90
    Chinese Journal of Population Resources and Environment02.60
    VIEW08.60
    HLA933.00
    INTERNATIONAL JOURNAL OF SOCIAL PSYCHIATRY011.50


以上SCI期刊相关数据和信息来源于网络,仅供参考。
投稿状态统计: 我要评分:

    同领域作者分享投稿经验:共247条 (包含回复)

我来分享

    联系我们 | 站点地图 | 友情链接 | 授权代理商 | 加入我们

    © 2010-2024 中国: LetPub上海分公司    网站备案号:沪ICP备10217908号-1    沪公网安备号:31010402006960

    增值电信业务经营许可证:沪B2-20211595

    礼翰商务信息咨询(上海)有限公司      办公地址:上海市徐汇区漕溪北路88号圣爱大厦1803室

    United States: Tel: 1-781-202-9968 Address: 400 5th Ave, Suite 530, Waltham, Massachusetts 02451