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MICROELECTRONICS RELIABILITY

2023年12月最新中科院分区表数据已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

按期刊名首写字母查看 MICROELECTRON R最新评论:找审稿人找了好久,投稿三个多月才给大修,修回后又等了两个多月接收,得发邮件催,投稿和返修都是催完就更新进度了,估计是编辑... (2024-02-20)


期刊名:   ISSN:   研究方向:   影响因子: -   SCI收录:
大类学科:   小类学科:   中科院分区:   是否OA期刊:   结果排序:

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MICROELECTRONICS RELIABILITY期刊基本信息Hello,您是该期刊的第87462位访客


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期刊名字MICROELECTRONICS RELIABILITYMICROELECTRONICS RELIABILITY

MICROELECTRON RELIAB
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
6.4
68人评分
我要评分

声誉
7.0

影响力
5.3

速度
8.9

期刊ISSN0026-2714
微信扫码收藏此期刊
2022-2023最新影响因子
(数据来源于搜索引擎)
1.6 点击查看影响因子趋势图
实时影响因子 截止2024年3月26日:1.548
2022-2023自引率12.50%点击查看自引率趋势图
五年影响因子1.7
h-index 80
CiteScore
CiteScoreSJRSNIPCiteScore排名
2.800.3640.787
学科分区排名百分位
大类:Engineering
小类:Safety, Risk, Reliability and Quality
Q284 / 192
大类:Engineering
小类:Electrical and Electronic Engineering
Q3406 / 738
大类:Engineering
小类:Condensed Matter Physics
Q3248 / 423
大类:Engineering
小类:Surfaces, Coatings and Films
Q378 / 131
大类:Engineering
小类:Atomic and Molecular Physics, and Optics
Q3126 / 211
大类:Engineering
小类:Electronic, Optical and Magnetic Materials
Q3168 / 271

期刊简介
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
期刊官方网站http://www.journals.elsevier.com/microelectronics-reliability/
期刊投稿网址https://www.editorialmanager.com/MICREL
期刊语言要求Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足MICROELECTRONICS RELIABILITY的语言要求,还能让MICROELECTRONICS RELIABILITY编辑和审稿人得到更好的审稿体验,让稿件最大限度地被MICROELECTRONICS RELIABILITY编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢
提交文稿
是否OA开放访问No
通讯方式PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB
出版商Elsevier Ltd
涉及的研究方向工程技术-工程:电子与电气
出版国家或地区ENGLAND
出版语言English
出版周期Monthly
出版年份1964
年文章数 329点击查看年文章数趋势图
Gold OA文章占比6.23%
研究类文章占比:
文章 ÷(文章 + 综述)
98.78%
WOS期刊SCI分区
2022-2023年最新版
WOS分区等级:4区

按学科分区JIF分区JIF排名JIF百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC
类别:SCIE
Q4213/275
学科:NANOSCIENCE & NANOTECHNOLOGY
类别:SCIE
Q495/107
学科:PHYSICS, APPLIED
类别:SCIE
Q4125/159
中科院《国际期刊预警
名单(试行)》名单
2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
中科院SCI期刊分区
2023年12月最新升级版
点击查看中科院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
工程技术 1区4区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区1区4区
NANOSCIENCE & NANOTECHNOLOGY
纳米科技
3区2区4区
PHYSICS, APPLIED
物理:应用
1区4区4区
中科院SCI期刊分区
2022年12月升级版
大类学科小类学科Top期刊综述期刊
工程技术 2区4区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区4区4区
NANOSCIENCE & NANOTECHNOLOGY
纳米科技
4区1区4区
PHYSICS, APPLIED
物理:应用
4区1区4区
中科院SCI期刊分区
2021年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 4区4区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区2区4区
NANOSCIENCE & NANOTECHNOLOGY
纳米科技
1区2区4区
PHYSICS, APPLIED
物理:应用
2区3区4区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0026-2714%5BISSN%5D
平均审稿速度网友分享经验:
较快,2-4周
来源Elsevier官网:
平均8.3周
平均录用比例网友分享经验:
容易
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在MICROELECTRONICS RELIABILITY顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
在线出版周期来源Elsevier官网:
平均13.3周
期刊常用信息链接
同领域相关期刊 MICROELECTRONICS RELIABILITY期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 MICROELECTRONICS RELIABILITY中科院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
MICROELECTRONICS RELIABILITY上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中科院SCI期刊分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发表论文
  • 中科院SCI期刊分区相关期刊
  • 同类著名期刊名称 h-index CiteScore
    IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE32630.40
    PROCEEDINGS OF THE IEEE25031.60
    IEEE SIGNAL PROCESSING MAGAZINE15522.40
    IEEE TRANSACTIONS ON FUZZY SYSTEMS17019.00
    PROGRESS IN QUANTUM ELECTRONICS5815.60
    IEEE TRANSACTIONS ON IMAGE PROCESSING24218.20
    IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING14812.40
    EXPERT SYSTEMS WITH APPLICATIONS16212.60
    IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMS11211.60
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY15411.20
    中科院SCI期刊分区同大类学科的热搜期刊 浏览次数
    Chemical Engineering Journal3324870
    Energy1328751
    Fuel1276631
    APPLIED ENERGY1201989
    Construction and Building Materials1040922
    JOURNAL OF POWER SOURCES961801
    INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH942655
    MEASUREMENT889754
    INTERNATIONAL JOURNAL OF HYDROGEN ENERGY873115
    ENERGY & FUELS833574
  •  

    MICROELECTRONICS RELIABILITY MICROELECTRONICS RELIABILITY
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
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  • 中国学者近期发表的论文
    1.Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder

    Author: Xu, Fengxian; Zhu, Wenjia; Yan, Jikang; Zhao, Lingyan; Lv, Jinmei
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 140, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114883
        DOI
    2.Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation

    Author: Xiang, Meiju; Wang, Duowei; He, Mu; Rui, Guo; Ma, Yao; Zhu, Xuhao; Mei, Fan; Gong, Min; Li, Yun; Huang, Mingmin; Yang, Zhimei
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114886
        DOI
    3.Small sample classification based on data enhancement and its application in flip chip defection

    Author: Sha, Yuhua; He, Zhenzhi; Gutierrez, Hector; Du, Jiawei; Yang, Weiwei; Lu, Xiangning
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114887
        DOI
    4.BP neural network for non-invasive IGBT junction temperature online detection

    Author: Liu, Li; Peng, Qianlei; Jiang, Huaping; Ran, Li; Wang, Yang; Du, Changhong; Chen, Jian; Zhou, Hongbo; Chen, Yang; Peng, Zhiyuan
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114882
        DOI
    5.Thermal stress and drop stress analysis based on 3D package reliability study

    Author: Xue, Leyang; Li, Xiang; Zhang, Hao
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114888
        DOI
    6.Study on the interface mechanism of copper migration failure in solder mask-substrate package

    Author: Li, Yesu; Lin, Shengru; Chi, Panwang; Zou, Yuqiang; Yao, Weikai; Li, Ming; Gao, Liming
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114891
        DOI
    7.Effect of temperature cycling on the leakage mechanism of TSV liner

    Author: Chen, Si; Jian, Xiaodong; Li, Kai; Li, Guoyuan; Wang, Zhizhe; Yang, Xiaofeng; Fu, Zhiwei; Wang, Hongyue
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114889
        DOI
    8.Simulation analysis of electromagnetic pulse susceptibility and hardening design for system-in-package SZ0501

    Author: Li, Ning; Li, Yang; Guo, Yaxin; He, Chaohui
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114892
        DOI
    9.Novel radiation-hardened SRAM for immune soft-error in space-radiation environments

    Author: Zhao, Qiang; Dong, Hanwen; Wang, Xiuying; Hao, Licai; Peng, Chunyu; Lin, Zhiting; Wu, Xiulong
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 140, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114862
        DOI
    10.Study of the temperature distribution in insulated gate bipolar transistor module under different test conditions

    Author: Zhao, Di; Guo, Chunsheng; Li, Yumeng; Pan, Shijie; Feng, Shiwei; Zhu, Hui
    Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 140, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114880
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    Nature Electronics038.30
    PROGRESS IN ENERGY AND COMBUSTION SCIENCE16159.00
    Annual Review of Fluid Mechanics16352.90
    IEEE Reviews in Biomedical Engineering027.80
    TRENDS IN BIOTECHNOLOGY19531.30
    Advanced Fiber Materials012.50
    BIOTECHNOLOGY ADVANCES16127.10
    RENEWABLE & SUSTAINABLE ENERGY REVIEWS22226.30
    Chemical Engineering Journal17221.50
    IEEE SIGNAL PROCESSING MAGAZINE15522.40
    同分区等级的其他期刊名称 h-index CiteScore
    HARVARD BUSINESS REVIEW02.40
    QJM-AN INTERNATIONAL JOURNAL OF MEDICINE1086.10
    Energy Material Advances08.50
    CLINICAL AND EXPERIMENTAL HYPERTENSION453.60
    Journal of Public Transportation07.00
    Asian Journal of Psychiatry010.90
    Chinese Journal of Population Resources and Environment02.60
    VIEW08.60
    HLA933.00
    INTERNATIONAL JOURNAL OF SOCIAL PSYCHIATRY011.50


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