R Bajaj - US Patent 20,110,143,640, 2011 - freepatentsonline.com ... 13. A method, comprising: polishing a first wafer using a polishing pad by pressing the first wafer against a polishing surface of the polishing pad; upon completion of said polishing, bringing a polishing pad conditioning head of a polishing pad conditioning apparatus in close ... Cached
N Kimura, K Ito, T Takahashi… - US Patent …, 2011 - freepatentsonline.com ... apparatus comprising: a substrate holder configured to hold the substrate; and a polishing head configured to polish the periphery of the substrate held by said substrate holder using the polishing tool, wherein said polishing head includes a press pad for pressing the polishing ... Cached
RC Cady, MJ Moore, MA Shalkey… - US Patent …, 2011 - freepatentsonline.com ... 20. The method of claim 19, further comprising introducing a fluid into an interior volume of the bonnet prior to pressing the bladder against the polishing pad to increasing a pressure within the bonnet. Description: BACKGROUND. ... Cached
K Nyholm - US Patent 7,893,926, 2011 - Google Patents ... their materials and simple shape. 60 According to a preferred embodiment of the invention, feeding control information by means of the touch pad requires pressing of the contact surface. Touch pads that require pressing typically ... Related articles - All 4 versions
RC Cady, MJ Moore, MA Shalkey… - US Patent 7,927,092, 2011 - Google Patents ... to be applied to the pad. The pressing technique allows uniform compliance of the pad to the bonnet form, yielding less pad irregularity, and greater polishing precision and predictabil- ity. In accordance with one or more embodiments ... Related articles - All 3 versions
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