R Bajaj, SM Fisher… - US Patent 20,110,143,539, 2011 - freepatentsonline.com A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an ... Cached
LDJ Valencia Merizalde… - US Patent …, 2011 - freepatentsonline.com A tool for polishing optical surfaces including a rigid base having a spherical surface which carries a resilient cushion with a polishing face. The diameter of the rigid base is between 50 and 65 mm, the radius of curvature of the spherical surface is between 54 and 60 mm, the ... Cached
T Yamazaki, S Kurokawa, Y Umezaki… - Advances in Science …, 2011 - Trans Tech Publ Tsutomu Yamazaki1, b, Syuhei Kurokawa1, c, Yoji Umezaki1, d, Osamu Ohnishi1,e, ... Yoichi Akagami2,f, Yasuhide Yamaguchi3,g, Sadahiro Kishii1,4,h ... 1Dept. of Mechanical Engineering, Kyushu University, Fukuoka 836-0395, Japan ... 3Mitsui Mining & Smelting ... Related articles
[CITATION] A study on the manufacturing of new hot melt adhesive polishing pad and its effects on polishing monocrystalline silicon and stainless steel workpiece
JC Chen, PJ Tzeng, SC Chen… - … (ECTC), 2011 IEEE …, 2011 - ieeexplore.ieee.org Abstract In this study, the optimization of Cu CMP performance (dishing) for removing thick Cu plating overburden due to Cu plating for deep TSVs in a 300mm wafer is investigated. Also, backside isolation oxide CMP for TSV Cu exposure is discussed. In order to obtain a minimum Cu ... Related articles
沪公网安备号：31010402006960 （网站）31010405000484 （蝌蝌APP）
安全保密
