2024年6月最新影响因子数据已经更新，欢迎查询！ 如果您对期刊系统有任何需求或者问题，欢迎反馈给我们。
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期刊名字 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS J MATER SCI-MATER EL （此期刊被最新的JCR期刊SCIE收录） LetPub评分 6.8
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声誉 7.2 影响力 6.1 速度 8.0 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 期刊ISSN | 0957-4522 | 微信扫码收藏此期刊 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| E-ISSN | 1573-482X | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 2023-2024最新影响因子 （数据来源于搜索引擎） | 2.8 点击查看影响因子趋势图 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 实时影响因子 | 截止2024年10月29日：2.121 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 2023-2024自引率 | 14.30%点击查看自引率趋势图 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 五年影响因子 | 2.7 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| JCI期刊引文指标 | 0.57 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| h-index | 63 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| CiteScore （ 2024年最新版） |
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| 期刊简介 |
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| 期刊官方网站 | https://www.springer.com/10854 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 期刊投稿网址 | https://www.editorialmanager.com/jmse | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 作者指南网址 | https://www.springer.com/10854/submission-guidelines | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 期刊语言要求 | Language Presenting your work in a well-structured manuscript and in well-written English gives it its best chance for editors and reviewers to understand it and evaluate it fairly. Many researchers find that getting some independent support helps them present their results in the best possible light. 经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件，不仅能满足JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS的语言要求，还能让JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人得到更好的审稿体验，让稿件最大限度地被JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）帮助作者准备稿件，已助力全球15万+作者顺利发表论文。部分发表范例可查看：服务好评 论文致谢（4篇） 。 提交文稿 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 是否OA开放访问 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 通讯方式 | SPRINGER, VAN GODEWIJCKSTRAAT 30, DORDRECHT, NETHERLANDS, 3311 GZ | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 出版商 | Springer US | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 涉及的研究方向 | 工程技术-材料科学：综合 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 出版国家或地区 | NETHERLANDS | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 出版语言 | English | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 出版周期 | Monthly | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 出版年份 | 1990 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 年文章数 | 2249点击查看年文章数趋势图 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Gold OA文章占比 | 2.18% | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 研究类文章占比： 文章 ÷（文章 + 综述） | 99.47% | |||||||||||||||||||||||||||||||||||||||||||||||||||
| WOS期刊SCI分区 （ 2023-2024年最新版） | WOS分区等级：2区
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| 中国科学院《国际期刊预警 名单（试行）》名单 | 2024年02月发布的2024版：不在预警名单中 2023年01月发布的2023版：不在预警名单中 2021年12月发布的2021版：不在预警名单中 2020年12月发布的2020版：不在预警名单中 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 中国科学院SCI期刊分区 （ 2023年12月最新升级版） | 点击查看中国科学院SCI期刊分区趋势图
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| 中国科学院SCI期刊分区 （ 2022年12月升级版） |
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| 中国科学院SCI期刊分区 （ 2021年12月旧的升级版） |
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| SCI期刊收录coverage | Science Citation Index Expanded (SCIE) (2020年1月，原SCI撤销合并入SCIE，统称SCIE) Scopus (CiteScore) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0957-4522%5BISSN%5D | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 平均审稿速度 | 期刊官网数据： 平均33 days, Submission to first decision 92 days, Submission to acceptance 网友分享经验： 平均1.5个月 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 平均录用比例 | 网友分享经验： 90% | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LetPub助力发表 | 经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍，平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）后论文在JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS顺利发表。
快看看作者怎么说吧：服务好评 论文致谢 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 收稿范围 | 期刊官网数据： 材料现代电子学中的应用的研究论文，期刊涉及的主题广泛，包括新材料（例如化合物和合金）的合成、生长和制备，加工、制造、键合和封装，微观结构的表征，结构-性质关系，电，光，介电和磁性能。以及新材料在电子领域的应用。 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 收录体裁 | 期刊官网数据： Research papers, commentaries, introductions, editorials, reports, errata, etc | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 编辑信息 | Editor-in-Chief: Safa Kasap University of Saskatchewan, Canada Founding Editor and Former Editor-in-Chief: Arthur F. W. Willoughby Southampton University, UK Deputy Editors-in-Chief: Jun Luo Chinese Academy of Sciences, China Patrick J. McNally Dublin City University, Ireland Editors: Peter Capper Selex ES, UK Homero Castaneda-Lopez Texas A&M University, USA Kalyan Kumar Chattopadhyay Javadpur University, India I.M. Dharmadasa Sheffield Hallam University, UK Chris Groves Durham University, UK C. Robert Kao National Taiwan University, Taiwan Maurizio Martino Università del Salento, Italy Yun Hau Ng City University of Hong Kong, Hong Kong Amlan J. Pal Indian Association for the Cultivation of Science, India Henry H. Radamson Royal Institute of Technology, Sweden Karthik Shankar University of Alberta, Canada Velumani Subramaniam CINVESTAV, Mexico Stephen Sweeney University of Surrey, UK Hongjing Wu Northwestern Polytechnical University, China Wu Yan China University of Geosciences (Wuhan), China Ying Yang Tsinghua University, China Bangmin Zhang Sun Yat-Sen University, China Fu Rong Zhu Hong Kong Baptist University, Hong Kong Assistant Editor: Chunzi Zhang University of Saskatchewan, Canada Editorial Board: Sadao Adachi, Gunma University, Japan; Dan Allwood, University of Sheffield, UK; Hajime Asahi, Osaka University, Japan; Neil S. Beattie Northumbria University, UK; Bhaskar Bhattacharya, Banaras Hindu University, India; Rana Biswas, Ames Laboratory & Iowa State University, USA; Anna Paola Caricato, Università del Salento, Italy; Y.C. (Archie) Chan, City University of Hong Kong, China; Parthasarathi Chakraborti, Intel Corporation, Hillsboro, Oregon, USA; Nandu Chaure, Savitribai Phule Pune University, India; Kunji Chen, Nanjing University, China; W. (Jim) Choyke, University of Pittsburgh, USA; Antonin Fejfar, Academy of Sciences of the Czech Republic, Czech Republic; Darrel Frear, Freescale Semiconductor, USA; Jan Evans-Freeman, University of Canterbury, New Zealand; Shubhra Gangopadhyay, University of Missouri-Columbia, USA; Christopher Gourlay, Imperial College London, UK; Jong Heo, Pohang University of Science and Technology, Korea; Dan Hewak, University of Southampton, UK; Oliver Ileperuma, Institute of Chemistry Ceylon, Sri Lanka; Alessia Irrera CNR- Institute for Chemical and Physical Processes (IPCF), Messina, Italy; Stuart J. C. Irvine, Swansea University, UK; Chennupati Jagadish, The Australian National University, Australia; David Jiles, Iowa State University, USA; Hannah J. Joyce, Cambridge University, UK; Zahangir Kabir; Concordia University, Canada; Karen Kavanagh, Simon Fraser University, Canada; Iwan Kityk Czestochowa University of Technology, Poland; Chien-Neng Liao, National Tsing Hua University, Taiwan; Leszek Malkinski, University of New Orleans, USA; Budhika Mendis Durham University, UK; Maria Mitkova Boise State University, USA; Yashowanta Mohapatra, Indian Institute of Technology Kanpur, India; Hadis Morkoç, Virginia Commonwealth University, USA; Hiroyoshi Naito, Osaka Prefecture University, Japan; Hiroshi Nishikawa, Osaka University, Japan; Habib Pathan, Savitribai Phule Pune University, India; Kristin M. Poduska, Memorial University of Newfoundland, Canada; Adithya Prakash, Intersil, USA; Jatin Rath Indian Institute of Technology, Madras, India; Alla Reznik Lakehead University, Thunder Bay, Canada; Ben Ruck, Victoria University of Wellingon, New Zealand; Harry Ruda, University of Toronto, Canada; Arie Ruzin Tel Aviv University, Israel; Rene van Swaaij, Delft University of Technology, The Netherlands; Katsuhisa Tanaka, Kyoto University, Japan; Ayse Turak, McMaster University, Canada; Takashi Uchino, Kobe University, Japan; Neil White, University of Southampton, UK; Takayuki Yanagida, Nara Institute of Science and Technology, Japan; Alex (Ya Sha) Yi, University of Michigan, USA | |||||||||||||||||||||||||||||||||||||||||||||||||||
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| 中国学者近期发表的论文 | |
| 1. | A facile fabrication of nanocomposites with dual conductive networks based on 3D nickel foam, 1D silver nanowires and 2D boron nitride nanosheets Author: Zhu, Shuangbao; Li, Weizhen; Yuan, Weichao; Meng, Yiming; Chu, Zhongyang; Gan, Wenjun Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09582-y DOI |
| 2. | Controllable preparation of CaCu3Ti4O12 nanowires and its strengthening effect on high dielectric polymer composites Author: Zhu, Min; Li, Guan; Xu, Haiping; Xie, Huaqing; Liao, Yangke Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09417-w DOI |
| 3. | Low-hysteresis perovskite solar cells based on a spray-coated electron transport layer Author: Zheng, Xiaohong; Su, Jian; Liu, Shanyi; Guo, Huafei; Gu, Ding; Jiang, Sai; Qiu, Jianhua Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09690-9 DOI |
| 4. | Relaxation behavior and energy storage of A-site substituted Sr4-xNa2-xLaxTa0.6Nb9.4O30 ferroelectric ceramics Author: Zheng, Xiao; Jin, Zuheng; Dan, Yuejun; Hu, Changzheng; Liu, Laijun; Fang, Liang Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 2, pp. -. DOI: 10.1007/s10854-022-09492-z DOI |
| 5. | Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties Author: Zhao, Zhili; Xiao, Kai; Quan, Wenlei; Hu, Mingdeng; Li, Jiazhe Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09675-8 DOI |
| 6. | Highly conductive films sintered by Au-Ag nanoparticles ink at low temperature Author: Zhang, Zhen; Li, Jinglong; Liu, Tao; Tian, Wenhuai; Li, Zhipeng Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 2, pp. -. DOI: 10.1007/s10854-022-09649-w DOI |
| 7. | Construction of foot-movement monitoring sensor based on triboelectric signals via embroidery technique with PDMS coated conductive cotton yarn Author: Zhang, Shichen Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 1, pp. -. DOI: 10.1007/s10854-022-09464-3 DOI |
| 8. | Sintering characteristics, crystal structure, and microwave dielectric properties of non-stoichiometric BaMg2V2+xO8 (0.04 <= x <= 0.16) ceramics Author: Zhang, Ping; Fan, Xinyue; Hao, Manman; Tian, Xin Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09558-y DOI |
| 9. | Efficient MXene/CNT electromagnetic shielding composite films with self-assembly multilayer structure Author: Zhang, Pengcheng; Ru, Xuanhe; Li, Haiyang; Liang, Haoyu; Wang, Huanping; Yang, Chenhui; Zhang, Xiaoguang; Liu, Zhenguo; Zhang, Qiuyu; Chen, Yanhui Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 1, pp. -. DOI: 10.1007/s10854-022-09498-7 DOI |
| 10. | A low reflection absorbent conductive carbon black-coated BaZn2Fe16O27 composite covering X and Ku bands Author: Zhang, Jing Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09655-y DOI |
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