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MICROELECTRONICS RELIABILITY 期刊收藏夹

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MICROELECTRONICS RELIABILITY期刊基本信息Hello,您是该期刊的第116486位访客


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期刊名字MICROELECTRONICS RELIABILITYMICROELECTRONICS RELIABILITY

MICROELECTRON RELIAB
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
6.6
77人评分
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声誉
7.1

影响力
5.6

速度
8.9

期刊ISSN0026-2714
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2025-2026最新IF
(数据来源于网友提供)
注册登录后,查看IF
实时影响因子 截止2026年5月06日:2.42
2025-2026自引率12.0%点击查看自引率趋势图
五年IF
(数据来源于网友提供)
2.196数据由网友[blue行者83]收集提供
h-index 80
CiteScore
2026年6月最新版
CiteScoreSJRSNIPCiteScore排名
4.500.4641.024
学科分区排名百分位
大类:Engineering
小类:Safety, Risk, Reliability and Quality
Q286 / 282
大类:Engineering
小类:Electrical and Electronic Engineering
Q2359 / 1030
大类:Engineering
小类:Condensed Matter Physics
Q2185 / 446
大类:Engineering
小类:Surfaces, Coatings and Films
Q259 / 141
大类:Engineering
小类:Atomic and Molecular Physics, and Optics
Q2102 / 243
大类:Engineering
小类:Electronic, Optical and Magnetic Materials
Q2142 / 318

期刊简介
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
期刊官方网站http://www.journals.elsevier.com/microelectronics-reliability/
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此模板来自于期刊/出版社官网。开通VIP可免费下载,并享1w+期刊模板资源。
期刊投稿网址https://www.editorialmanager.com/MICREL
该期刊中国学者近期发文 - NewThermal-mechanical co-design and optimization of 2.5D chiplet integration
Author: Cao, Liang; Zhang, Shiwen; Rong, Yaohui; Li, Menghan; Gong, Maogao; Xia, Junsheng; Guo, Xiaohui
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 182, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116156


Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes
Author: Jin, Yu; Wang, Chen; Xu, Wen-Jie; Zhou, Zhi-Yi; Gao, Xiao-Yu; Liu, Yu-Cheng; Shen, Ying; Wu, Yong; Li, Wei-Long; Zhang, Pan-Long; Qi, Dong-Yu; Liu, Jin-Tao; Chen, Zhao-Li; Hsiao, Chueh-Sheng; Zhang, Feng-Xue; Liu, Xin-Yu; Han, Dong
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 182, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116159


paper Reliability-critical gate identification based on sensitivity and stochastic computing
Author: Ding, Caishuo; Wang, Zhen
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 182, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116168


Copula based SFP plus transceiver MTTF estimation method by using optical power and sensitivity
Author: Li, Wei; Gao, Cheng; Huang, Jiaoying; Du, Weiyang
Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116148


期刊语言要求Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足MICROELECTRONICS RELIABILITY的语言要求,还能让MICROELECTRONICS RELIABILITY编辑和审稿人得到更好的审稿体验,让稿件最大限度地被MICROELECTRONICS RELIABILITY编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评(1篇) 论文致谢
提交文稿
是否OA开放访问No
通讯方式PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB
出版商Elsevier Ltd
涉及的研究方向工程技术-工程:电子与电气
出版国家或地区ENGLAND
出版语言English
出版周期Monthly
出版年份1964
年文章数 303点击查看年文章数趋势图
Gold OA文章占比17.15%
研究类文章占比:
文章 ÷(文章 + 综述)
97.69%
期刊分区表预警名单 2026年03月发布的新锐学术版:不在预警名单中

2025年03月发布的2025版:不在预警名单中

2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
《新锐期刊分区表》
2026年3月发布
点击查看期刊分区表趋势图
大类学科小类学科Top期刊综述期刊
工程技术 3区4区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区3区4区
NANOSCIENCE & NANOTECHNOLOGY
纳米科技
4区4区4区
PHYSICS, APPLIED
物理:应用
2区4区4区
N/A
期刊分区表
2025年3月升级版
大类学科小类学科Top期刊综述期刊
工程技术 3区3区2区
PHYSICS, APPLIED
物理:应用
1区1区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区3区4区
NANOSCIENCE & NANOTECHNOLOGY
纳米科技
3区2区4区
期刊分区表
2023年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 4区4区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区3区4区
NANOSCIENCE & NANOTECHNOLOGY
纳米科技
4区4区4区
PHYSICS, APPLIED
物理:应用
1区2区4区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0026-2714%5BISSN%5D
平均审稿速度网友分享经验:
较快,2-4周
来源Elsevier官网:
平均8.3周
平均录用比例网友分享经验:
容易
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在MICROELECTRONICS RELIABILITY顺利发表。
快看看作者怎么说吧:服务好评(1篇) 论文致谢
提交文稿
在线出版周期来源Elsevier官网:
平均13.3周
期刊常用信息链接
同领域相关期刊 MICROELECTRONICS RELIABILITY期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 MICROELECTRONICS RELIABILITY期刊分区表趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
MICROELECTRONICS RELIABILITY上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 期刊分区表趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发文
  • 期刊分区表相关期刊
  • 同类著名期刊名称 h-index CiteScore
    PROCEEDINGS OF THE IEEE25060.30
    IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE32641.10
    IEEE TRANSACTIONS ON IMAGE PROCESSING24221.70
    IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING14822.70
    PROGRESS IN QUANTUM ELECTRONICS5819.70
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY15418.10
    IEEE SIGNAL PROCESSING MAGAZINE15520.80
    IEEE TRANSACTIONS ON FUZZY SYSTEMS17020.50
    EXPERT SYSTEMS WITH APPLICATIONS16217.00
    PATTERN RECOGNITION18017.30
    期刊分区表同大类学科的热搜期刊 浏览次数
    Energy2239998
    APPLIED ENERGY1769486
    Fuel1764521
    MEASUREMENT1680905
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT1630896
    IEEE SENSORS JOURNAL1579934
    Construction and Building Materials1574551
    SEPARATION AND PURIFICATION TECHNOLOGY1290553
    INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH1143038
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS1131894
  •  

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  • 中国学者近期发表的论文
    1.Thermal-mechanical co-design and optimization of 2.5D chiplet integration

    Author: Cao, Liang; Zhang, Shiwen; Rong, Yaohui; Li, Menghan; Gong, Maogao; Xia, Junsheng; Guo, Xiaohui
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 182, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116156
        DOI
    2.Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes

    Author: Jin, Yu; Wang, Chen; Xu, Wen-Jie; Zhou, Zhi-Yi; Gao, Xiao-Yu; Liu, Yu-Cheng; Shen, Ying; Wu, Yong; Li, Wei-Long; Zhang, Pan-Long; Qi, Dong-Yu; Liu, Jin-Tao; Chen, Zhao-Li; Hsiao, Chueh-Sheng; Zhang, Feng-Xue; Liu, Xin-Yu; Han, Dong
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 182, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116159
        DOI
    3.paper Reliability-critical gate identification based on sensitivity and stochastic computing

    Author: Ding, Caishuo; Wang, Zhen
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 182, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116168
        DOI
    4.Copula based SFP plus transceiver MTTF estimation method by using optical power and sensitivity

    Author: Li, Wei; Gao, Cheng; Huang, Jiaoying; Du, Weiyang
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116148
        DOI
    5.Degradation induced by total ionizing dose and electrical stress in a bulk 28-nm ring oscillator

    Author: Gou, Shilong; Yao, Zhibin; Chen, Wei; Ding, Lili; Ma, Wuying; Wang, Zujun; Sheng, Jiangkun; Xue, Yuanyuan
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116149
        DOI
    6.Investigation on the interfacial electrical breakdown failure behavior in through silicon vias

    Author: Chen, Xiaoting; Chen, Xianyi; Jia, Jie; Hua, Nan; Chen, Si; Yang, Xiaofeng; Liu, Jiaru; Lu, Xiangjun; Lu, Shengguo; Lu, Guoguang; Wang, Changhong; Zhou, Bin; Jian, Xiaodong
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116154
        DOI
    7.Multi-board parallel irradiation testing of neutron-induced soft errors in 16 nm FinFET and 22 nm planar FPGAs (vol 180, 116083, 2026)

    Author: Luo, Enming; Yu, Qirui; Wu, Zhaohui; Li, Bin; Zhu, Dayong; Dong, Yu-Feng
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116150
        DOI
    8.Research on packaging damage and final failure of large-scale plastic-encapsulated power module under thermal stress

    Author: Zhu, Zhanshan; Zhang, Yuexin; Cao, Yang; Cui, Dingyuan; Xiao, Jianxiang; Xu, Min
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116112
        DOI
    9.An analytical-numerical thermal modeling method for multilayer PCBs including lateral surface heat transfer

    Author: Zhang, Yabin; Chen, Lin; Luo, Shenyuan
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116120
        DOI
    10.Thermal reliability of 2D materials integrated with silicon-based CMOS ICs and analysis under complex conditions

    Author: Huang, Jinfeng; Ye, Yuxin; Malik, Muhammad; Anwar, Muhammad Abid; Liu, Guanyu; Zhao, Yuda; Ma, Hanzhi; Yu, Bin; Xu, Yang
    Journal: MICROELECTRONICS RELIABILITY. 2026; Vol. 181, Issue , pp. -. DOI: 10.1016/j.microrel.2026.116123
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    Nature Reviews Bioengineering040.30
    Nature Electronics052.50
    PROGRESS IN ENERGY AND COMBUSTION SCIENCE16187.50
    Annual Review of Fluid Mechanics16343.30
    International Journal of Extreme Manufacturing029.30
    PROGRESS IN AEROSPACE SCIENCES9734.80
    INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE13335.30
    Green Energy and Intelligent Transportation026.80
    Applied Mechanics Reviews9928.30
    Advances in Applied Energy026.60
    同分区等级的其他期刊名称 h-index CiteScore
    BRITISH JOURNAL OF BIOMEDICAL SCIENCE4012.70
    Cancer Genetics355.50
    GetMobile-Mobile Computing & Communications Review00.00
    MedComm - Oncology05.30
    Bulletin of the Peabody Museum of Natural History136.80
    Life Medicine06.10
    JBI Evidence Synthesis08.00
    SEMINARS IN ONCOLOGY1254.90
    Turkish Journal of Emergency Medicine05.90
    Cancer Pathogenesis and Therapy06.20
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